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Tutorial 1

Power-Aware Testing and Test Strategies for Low Power Devices


Patrick Girard (LIRMM/CNRS)
Nicola Nicolici (McMaster University)
Xiaoqing Wen (Kyushu Institute of Technology)


Power dissipation is becoming a critical parameter during manufacturing test as the device can consume much more power during test than during functional mode of operation. In the meantime, elaborate power management strategies, like voltage scaling, clock gating or power gating techniques, are used today to control the power dissipation during functional operation. The usage of these strategies has various implications on manufacturing test, and power-aware test is therefore increasingly becoming a major consideration during design-for-test and test preparation for low power devices. This tutorial provides knowledge in this area. It is organized into three main parts. The first one gives necessary background and discusses issues arising from excessive power dissipation during test application. The second part provides comprehensive knowledge of structural and algorithmic solutions that can be used to alleviate such problems. The last part surveys low power design techniques and shows how these low power devices can be tested safely without affecting yield and reliability.

Tutorial 2

System-in-Package Test Strategies


Yervant Zorian (Virage Logic Corp)


Today's miniaturization and performance requirements result in the usage of high density advanced packaging technologies, such as System-in-Package (SiP), 3D integration, Direct Chip Attach, Package-inpackage. Due to their physical access limitation, the complexity and cost associated with their test and diagnosis are considered major issues facing their use. This tutorial provides comprehensive knowledge of test solutions for advanced packages by placing particular emphasis on: test and debug approaches for bare dies; testing schemes for 3D packages, flip-chips used in direct chip attach, and SiP packages; testing bare substrates, and finally test, diagnosis and repair techniques for assembled modules.